
The DFN3820A showcases the ingenuity of packaging technology:
DFN3820A dimensions: 3.8 mm x 2.0 mm;
DFN3820A height: 0.88 mm, achieving a breakthrough in miniaturization in terms of space utilization.
The DFN3820A packaging technology is perfectly compatible with SMP (DO-220AA) packaging, along with a 12% reduction in height, making the DFN3820A more compact in electronic designs. It accommodates larger wafer sizes, further providing designers with valuable design space and flexibility.
The DFN3820A excels not only in size but also in its high current density and efficiency, demonstrating powerful performance. Specifically, for Schottky diodes, the DFN3820A packaging is on par with the larger SMPC (TO-277A) packaging, and Schottky diodes can easily handle currents of up to 7 A. Its power density is twice that of the SMP (DO-220AA) packaging structure. The DFN3820A packaging's TVS can achieve surge power of up to 600 W, comparable to traditional SMB (DO-214AA) packaging.
In terms of manufacturing and integration, the DFN3820A's tin-plated wettable flanks enable cost-effective yet highly efficient "Automated Optical Inspection" (AOI), ensuring the high safety and reliability standards required in industries such as automotive.
In terms of thermal performance, its low forward conduction and larger wafer size, combined with a unique structural design, ensure superior heat dissipation.
The DFN3820A has also passed AEC-Q101 and Vishay's automotive-grade certifications, proving its excellence not only in performance but also in reliability, meeting the industry's high standards. For manufacturers of new energy and autonomous vehicles, such rigorously certified components are undoubtedly key to ensuring product safety and stable operation.
In summary, the introduction of the DFN3820A packaging technology is undoubtedly a significant technological innovation in the field of diodes, particularly suitable for the automotive electronics market, where the demand for miniaturized components continues to grow.


Standard rectifier products using DFN3820A packaging feature multiple voltage ranges of 200 V, 400 V, and up to 600 V, with current ratings from 2 A to 4 A. Under thermal equilibrium conditions, their performance is more than twice that of the SMP (DO-220AA) packaging structure. Additionally, their electrostatic discharge resistance meets the IEC61000-4-2 air discharge mode, with typical performance >15 kV, and they have a wide operating junction temperature range from -55°C to 175°C. They are widely used in automotive, telecom power supplies, 5G, industrial applications, and more, with typical applications including general rectification, polarity protection, and rail-to-rail protection.

Vishay's ultrafast recovery rectifiers adopt FRED Pt® GEN 2 chip technology with a 200 V design. Their current ratings range from 1 A to 5 A, and under thermal equilibrium conditions, their performance is more than twice that of the SMP (DO-220AA) packaging structure. Compared to today's solutions (such as SMP, SlimSMAW, or traditional SMA SMB), they offer excellent thermal performance and save significant PCB space. Additionally, they feature extremely low forward voltage, ultrafast recovery time, and low switching losses. These products have an operating junction temperature range from -55°C to 175°C and are widely used in automotive and industrial applications, such as DC-DC converters, ECUs, dual-voltage injector drivers, ABS, airbags, LED lighting, snubbers, freewheeling diodes, and polarity protection.

Vishay's Schottky rectifiers TMBS® primarily include 60 V, 100 V, and 150 V designs using TMBS® Gen 3 chip technology, as well as 200 V designs using TMBS® Gen 2 chip technology. Their current ratings range from 2 A to 7 A. Additionally, they feature extremely low forward voltage and reverse leakage, as well as low junction capacitance, reducing switching losses in active devices. These products have an operating junction temperature range of -40°C to 175°C. Introducing Schottky rectifiers in the ultra-compact DFN3820A packaging (0.88 mm height) is also industry-leading. Their density is 50% higher than traditional SMA (DO-214AC) and 12% higher than SMF (DO-219AB). In PCB layouts, they save 85% of space compared to traditional SMB (DO-214AA) and 42% compared to the eSMP® series SlimSMAW (DO-221AD). Compared to SMP (DO-220AA), their current ratings are doubled. Additionally, their optimized internal structure provides excellent thermal performance.

These TMBS® are widely applicable in automotive and industrial fields, including LED drivers, ADAS and OBC DC/DC converters, freewheeling diodes for DC motors, switching power supplies, notebook adapters, reverse polarity diodes, Power over Ethernet, and more.

Building on the DFN3820A packaging technology, Vishay has successfully developed TVS rectifiers with surge power up to 600 W. These TVS rectifiers feature unidirectional designs ranging from 12 V to 51 V and bidirectional designs ranging from 12 V to 100 V, with performance fully comparable to SMB (DO-214AA) and SlimSMAW (DO-221AD). Additionally, they have a wide operating junction temperature range from -65°C to 175°C. These TVS rectifiers can be widely applied in automotive ADAS, BMS, steering systems, domain controllers, and central control units.

The automotive industry is at a historic turning point. Amid this wave of transformation, Vishay, with its leading DFN3820A packaging technology, is paving a new path for the miniaturization and high efficiency of diodes. It is through such technological advancements that we can face and embrace the challenges and demands of the new automotive era, welcoming a brighter future for the automotive industry.
Reprinted from Vishay