- The demand for compact and highly reliable interconnects is not limited to the automotive sector but also extends to consumer electronics, industrial automation, medical devices, and smart agriculture;
- Combining the advantages of miniaturization and ruggedization can significantly enhance space utilization, reliability, design flexibility, signal integrity, and thermal management capabilities;
- Advancements in material science, innovative design techniques, and continuous development in manufacturing processes help reduce challenges faced by the industry in reshaping the next generation of compact and durable connectors.
Molex recently released a report titled "Breaking Boundaries: Combining Ruggedization and Miniaturization in Connector Design". This report delves into how providing rugged and miniaturized interconnect solutions unlocks new opportunities for innovation in electronic devices across various industries. The report focuses on design trends, trade-offs, and enabling technologies that remove barriers and help shape the future of electronic products.
Carrieanne Piccard, Vice President and General Manager of Molex Connected Mobility Solutions, stated:
“As new automotive platforms demand more electronic devices, the market is increasingly seeking smaller, more rugged interconnect products that can operate reliably in extreme environments. Therefore, making connectors more durable and compact has become a core design principle, requiring a holistic approach throughout the component lifecycle to achieve optimal product reliability, performance, and longevity.”
Connectors Driving Innovation Across Industries
In this industry report, Molex defines miniaturized connectors as those with terminal pitches of no more than 2.54mm, while ruggedness is characterized by the ability to withstand harsh environments and mechanical stress. This trend of combining miniaturization and ruggedization in connectors is driving significant innovation in the automotive industry, particularly in supporting electric vehicles (EVs) and zonal architectures. Currently, this trend is permeating other industries, including consumer electronics (e.g., fitness trackers, smartwatches, and smart home devices), industrial automation (e.g., industrial robots, touchscreens, and sensors), and medical devices (e.g., endoscopes, insulin pumps, and wearable health monitors).
Compact and rugged connectors are also highly valued in smart agriculture and other applications. Vertical farming systems equipped with dense sensors and lighting require space-saving connectors that can operate continuously in humid environments. Meanwhile, smaller, lighter, and more robust connectors in agricultural drones or "flying tractors" need protection against extreme temperatures, excessive vibration, and exposure to moisture, dust, and corrosive chemicals.
Breaking Design Boundaries
Molex's latest report explores best practices for overcoming major design and manufacturing obstacles to enable the creation of smaller, lighter, and more reliable connectors. Aluminum alloys, specialized high-strength steels, and high-performance polymers offer excellent durability and lightweight structures. However, processing these materials into complex geometries for connectors often requires specialized techniques, including micro-molding, high-precision machining, laser welding, or selective plating.
Additionally, high-density terminal pitch layouts can increase contact density to accommodate smaller device sizes but require high-precision manufacturing and assembly. This can introduce risks such as crosstalk and thermal management challenges. To address these issues, engineers can employ advanced signal routing techniques, shielding measures, and thermal management strategies, such as heat sinks or thermal vias. Molex's DuraClik connector housings, made from high-temperature PBT materials, feature robust terminal retention capabilities to withstand extreme automotive environments.
▲DuraClik Connectors
Multi-function terminals (MFT) integrate multiple functionalities (power, signal connections, and even mechanical features like locking mechanisms) into a single compact connector, marking a significant leap in miniaturized connector technology. Molex's latest report examines key environmental factors affecting component reliability and proposes strategies and solutions to ensure optimal connector performance under extreme conditions. Its stress-relief features and terminal designs enhance connector performance, enabling stability under continuous vibration, shock, and frequent mating operations.
In Molex's global reliability labs, engineers simulate real-world conditions such as vibration, temperature cycling, and exposure to harsh chemicals. MolexMicro-Lock Plus connectors feature a mandatory locking mechanism to ensure secure connections and prevent accidental disconnections under high-vibration conditions. Its metal solder tabs provide additional stress relief for solder joints, enhancing resistance to mechanical stress and vibration.
▲Micro-Lock Plus Connector Series
Even tiny amounts of water or dust can cause circuit corrosion and short circuits, leading to device failure, making effective protection measures critical. Molex's Squba connectors, equipped with IP68-rated sealing technology, can operate underwater at a depth of 5 feet for 30 minutes without being affected by water. These meticulously designed connectors optimize power transmission paths in their smallest and most durable form.
▲Squba Connectors
As devices continue to shrink in size and grow in functionality, Molex engineers are constantly pushing the boundaries of miniaturization and ruggedization to solve real-world business challenges and exceed customer expectations.