With the transformative development of data centers, the market's demand for responsive and optimized equipment is becoming increasingly urgent, especially in fields utilizing high-performance computing (HPC) and artificial intelligence (AI). Data centers are under growing pressure, pushing their infrastructure to the limits of capacity, and urgently require robust and adaptable solutions to enhance the performance of various devices and extend the lifespan of existing assets.
Challenges Facing Open Accelerator Infrastructure (OAI)
In this new landscape, accelerator modules have become a critical solution. They offer diverse functionalities, significantly improving device performance, surpassing the capabilities of traditional CPUs, and enhancing the efficiency of target devices. During the design process of accelerator modules, designers have considered scalability and adaptability, enabling seamless integration into existing systems to meet the ever-changing demands of various technologies and applications.
However, adopting accelerator modules with PCIe CEM form factors is becoming a barrier to efficient data center scaling. The reasons include:
• Significant signal insertion loss from ASIC (Application-Specific Integrated Circuit) to PCIe connectors
• Complex inter-card wiring reduces system reliability and maintainability
• Certain limitations in supporting topologies between ASICs
Co-Packaged Solutions
To address these challenges, co-packaged connectors have emerged as an efficient alternative solution. This interface method has gained favor with the Open Compute Project (OCP) and plays a role in OCP's Open Accelerator Infrastructure (OAI) initiative. By leveraging high-density connector designs, it not only enhances I/O link performance but also ensures low signal transmission loss, achieving high-speed interconnectivity.
To tackle these challenges, OCP introduced the Open Accelerator Module (OAM), providing ample space for the accelerator itself, local logic, and power components, while supporting various cooling solutions, including air and liquid cooling systems. Additionally, the flexibility of this design is reflected in the interconnect topology between modules, which can meet diverse design requirements.
By adopting co-packaged connector modules, customers can leverage enhanced modular design, scalability, and compatibility, establishing a solid foundation for seamless integration in various computing environments, thereby driving innovation in cutting-edge fields such as high-performance computing.
Outstanding Design Features Tailored for Accelerator Modules
Molex's Mirror Mezz high-speed connector redefines the future of Open Accelerator Modules with its innovative solutions optimized for OAI. Mirror Mezz employs a genderless mated interface to deploy accelerator modules, ensuring stable and reliable connections. Its complete mating kit requires only a single part number, simplifying procurement and assembly processes, improving installation efficiency, and reducing the complexity of bill of materials (BOM) management.
The contact design features a "burr-free" structure, providing excellent signal integrity to meet the high-speed demands of modern computing infrastructure.
The highlight of Mirror Mezz's design lies in its high flexibility, offering multiple stacking heights such as 11mm, 8mm, and 5mm to accommodate different application scenarios. Its robust blind-mate guide and pin shield design effectively protect the connector, ensuring precise contact alignment and preventing contact damage, thereby enhancing product durability and reliability.
Additionally, the Mirror Mezz connector utilizes flat ball grid array (BGA) surface-mount technology (SMT) for termination, enhancing flexibility and integration. This widely adopted termination method is favored by contract manufacturers and original design manufacturers for its ease of use, enabling efficient and cost-effective streamlined manufacturing.
Committed to Building Open Infrastructure
As an active participant in the OCP (Open Compute Project), Molex leads the industry in designing and developing hardware that meets OCP requirements.
Incorporating the Mirror Mezz co-packaged connector into the specifications of OCP and the Open Data Center Committee (ODCC) highlights its relevance and adaptability in meeting current and future computing needs. This award-winning connector, with its exceptional design and powerful functionality, opens a new chapter in the development of Open Accelerator Infrastructure, effectively addressing the growing demands of data centers.
▲Mirror Mezz Co-Packaged Connector