Molex has released a new report exploring the convergence of ruggedization and miniaturization in interconnect design trends, trade-offs, and emerging technologies.
The demand for compact and highly reliable interconnections is not limited to the automotive sector but also extends to consumer electronics, industrial automation, medical devices, and smart agriculture. Combining the advantages of miniaturization and robustness can significantly enhance space utilization efficiency, reliability, design flexibility, signal integrity, and thermal management capabilities. Thanks to advancements in material science, innovative design techniques, and the continuous development of manufacturing processes, the industry is better positioned to reshape the next generation of compact solutions.